Intel Says New Packaging Technology to Enable Billion-Transistor Processors

SANTA CLARA, CA -- Intel Corporation today announced its researchers have developed a new semiconductor packaging technology that will help the company build processors with more than 1 billion transistors that will be 10 times faster than the fastest processors today. The technology, called "Bumpless Build-Up Layer" or BBUL packaging, takes a completely different approach to packaging from the current practice of manufacturing the processor die separately and later bonding it to the package. Instead, BBUL "grows" the package around the silicon, resulting in thinner, higher-performance processors that consume less power.

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