ACADEMIA

SMART Modular Technologies, an independent manufacturer of memory modules, embedded computing subsystems, and TFT-LCD display products, has launched a new family of liquid-cooled DDR2 registered DIMMs (RDIMMs) that are designed to remove heat more effectively than conventional RDIMMs air-cooled using fans or heat sinks. The RoHs-compliant modules are designed to work in standard blade server and high performance computing (HPC) applications with chassis fitted for closed-looped liquid cooling. "With these new RDIMMs, SMART directly addresses an industry-wide problem of controlling excessive, or less than optimal, operating temperatures," explained Mike Rubino, SMART's Vice President of Engineering. "By taking an innovative approach to heat removal, our new product offers multiple benefits, including better performance and improved reliability; lower operating temperature and lower power consumption; reduced footprint and reduced noise emissions; and fewer single bit errors." Engineered using dual-die-package (DDP) technology incorporating a very low profile (VLP), SMART's liquid-cooled CoolFlex DDR2 VLP RDIMMs use a four-sided flexible printed circuit board folded over an aluminum core. SMART has integrated technology from SprayCool that continuously pumps an inert liquid (FluorinertT) within a closed-loop architecture. The system consists of flexible plastic tubes that run from the manifold to the individual processors and memory modules. Specialized heat sinks distribute the liquid across the processor and through the memory modules to draw out the heat. The heated fluid from the processors and the memory modules is then returned to the thermal server, where it is processed through the heat exchanger and circulated back into the server. "Implementing SprayCool cooling solutions can reduce the power requirements of a data center up to 50%," reported Rob Savette, Vice President Corporate Development at SprayCool. "A 25,000 sq. ft. data center can save as much as $400,000 in power costs annually. With the addition of SMART's liquid-cooled CoolFlex RDIMMs into the overall cooling system, we expect customers will experience even greater power savings while raising the reliability of their systems." SMART's liquid-cooled CoolFlex DDR2 VLP RDIMMs are available in 2GB and 4GB densities and configured as 256Mx72 and 512Mx72. They are built with mainstream 128Mx4 devices, making them one of the industry's most cost-effective solutions for HPC applications. The ordering part numbers for the 2GB and 4GB liquid-cooled CoolFlex DDR2 VLP RDIMMs are SG572564XG8E0IL1 and SG572124XG8P0IL1, respectively.