ENGINEERING

Company’s Silicon CMOS Photonics technology to be used in multi-vendor demonstration of 4 x 25G chip-to-module application

News Highlights:

• Luxtera joins largest number of component suppliers to test the next-gen technologies enabling 100G solutions

• Demonstrations of OIF’s Physical and Link Layer operating with Luxtera’s Silicon Photonics devices in QSFP28 optical form factor

Luxtera has announced its participation in the Optical Internetworking Forum’s (OIF) multi-vendor 4 x 25G chip-to-module interoperability demonstration at this year’s OFC/NFOEC. The multi-vendor demonstration will take place at the OIF booth #2769 on March 19-21 in Anaheim, California.

Luxtera’s Silicon CMOS Photonics technology enables high-performance computing for applications such as optical networking, CPU interconnect, and data storage. For this particular demonstration, OIF will leverage Luxtera’s technology to showcase how high-speed optical communication devices can be built into the most popular QSFP28 form factor using proven, low-cost silicon manufacturing technology - ultimately bringing Silicon CMOS Photonics to the mainstream market.   

“With over 500K chipsets sold, Luxtera’s Silicon CMOS Photonics continues to scale to support the mainstream interconnect market by offering reliable, scalable, and cost-effective solutions that fit in the most desired form factor,” said Chris Bergey, vice president of marketing for Luxtera. “QSFP is clearly the datacenter connector of choice for inter-datacenter connectivity as it offers the greatest pluggable module density possible in a 1U faceplate and will dominate the transition to 100G in datacenter switches, much as QSFP 40G is doing today.”