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Siemon announces 40+Gb/s SFF-8470 4X Passive Copper cabling assemblies. These high-speed, low latency SFF-8470 assemblies offer data transfer rates from 2.5Gb/s to 10+ Gb/s per lane for support of high-speed interconnect applications such as high-performance computing (HPC), enterprise networking and network storage systems.

Siemon has announced the release of their 40+Gb/s SFF-8470 4X Passive Copper cabling products. These SFF-8470 copper cable assemblies support high-speed interconnect applications such as high-performance computing (HPC), enterprise networking and network storage systems. The low latency assemblies support data transfer rates from 2.5Gb/s to 10+ Gb/s per lane. For infomation, visit http://www.siemon.com/is/.

Siemon’s 8470 cable assemblies feature a shielded wafer construction where the signal conductors are directly attached to the connector's contacts eliminating a printed circuit board and enhancing noise resistance to maximize signal integrity. The twin-axial shielded cable conductors are laser welded reducing cross-talk and jitter to support 10+Gb/s data rates. SFF-8470 die cast back shells and latch are interoperable with all compliant interfaces.

The 8470 product supports a wide array of data protocols/interfaces, including InfiniBand SDR, DDR and QDR; Ethernet 10GBaseCX4, 40GBaseCR4. These cables also support FibreChannel, RapidIO, Myrinet, SAS, SATA, Aurora, VITA VXS and XAUI/XAUI-2 IO interface links as well as SONET/SDH.

Product options available include 24 to 30 wire gauges and various assembly lengths for specific applications.

“Siemon's SFF 8470 supports the second generation of the Shielded Multi-Lane SFF-8470 copper cabling standard with data rates through 10+Gb/s per lane for IO interface applications” said Ed Cady, Business Development Manager for Siemon Interconnect Solutions division. “This IO connector interface has had wide standards and value-added interface link design-ins."