INDUSTRY

International Rectifier, IR, a world leader in power management technology, will demonstrate its power management advancements for high performance computing and server applications at the Intel Developer Form (IDF) taking place in San Francisco's Moscone Center West, September 26 to 29, 2006. "With the release of Intel's forward-looking specifications that drive the computing industry, IR's leading-edge power management technologies, chipsets and architectures make us well-equipped to respond to Intel's required power efficiencies and densities," said Tim Phillips, vice president of International Rectifier's DC-DC products. At IDF, International Rectifier will display its product families addressing the latest Intel standards, including: DC-DC Controller ICs IR's DC-DC controller ICs provide high current density for multiphase converters as well as dual- and single-output synchronous buck converters. Voltage regulators provide clean regulated voltages to various loads such as microprocessors, microcontrollers, memory chips, and low-voltage logic circuits and drivers, while offering protection and filtering from electrical transients and noise. XPhase Control Chipset and Distributed Power Architecture IR's XPhase chipset is scalable, distributed power architecture for today's advanced microprocessors. Developed specifically for multiphase interleaved buck DC-DC converters, IR's XPhase chipset consists a control IC and multiple Phase ICs. Unlike other multiphase solutions that are limited in the number of phases they drive, IR's XPhase architecture can support from one to "X" phases, which can be added or removed without changing the fundamental design. The XPhase chipset is designed to increase power density and efficiency in desktops, servers, voltage regulator modules (VRM) and embedded systems. By increasing the number of phases from five to seven, the current in each phase is decreased, and enables the use of smaller inductors and reduced output capacitors. This enables a reduction in footprint size from 3200mm2 to 2400mm2, a 25% reduction in board area. Patented DirectFET MOSFET Chipsets International Rectifier's patented DirectFET power package is a breakthrough surface-mount power MOSFET packaging technology designed for efficient topside cooling in either an SO-8 or Micro8 footprint. In combination with improved bottom-side cooling, the package can be cooled on both sides to cut part count by up to 60%, and board space by as much as 50% compared to devices in standard or enhanced SO-8 packages. This effectively doubles current density (A/in2) at a lower total system cost. The DirectFET MOSFET family includes matched 20V and 30V synchronous buck converter MOSFET chipsets, as well as 40V, 80V, and 100V devices targeted at primary-side control and synchronous rectification in 24V and 48V input power supplies. In addition, new chipsets that include DirectFET power MOSFETs and a PWM control IC with integrated drivers, enable as much as 40% smaller circuit size and reduced part count. For more information, please visit International Rectifier on the show floor or visit them on the web at its Web site.