INDUSTRY

MILPITAS, CA -- LSI Logic Corporation (NYSE: LSI) today announced it is supplying high-performance I/O and system ASICs to Sun Microsystems (Nasdaq: SUNW - news) for its 8-way Sun Fire V880 server family. LSI Logic's market-proven technologies and design expertise accelerated the successful development of this cost-effective, Right-First-Time(TM) ASIC chipset for Sun. At the heart of the Sun designed chipset are two 1.2-million-gate application-specific integrated circuits (ASICs). These host bridge ASICs each provide the UltraSPARC III system with a high-performance bus connection to dual 64-bit PCI and a high-speed Sun graphics interface. They connect to a high performance switched interconnect fabric, made up of an address repeater, a data control switch and 6 multi-port data crossbar switches, which can sustain an aggregate throughput of 9.6GB/s. ``LSI Logic's engineering talent, technology and ability to deliver the ASIC chipsets for our new Sun Fire V880 servers allowed us to meet critical program milestones,'' said Willis Hendley, director of engineering, Volume Systems Products division, Sun Microsystems. ``We worked with LSI Logic to develop a flexible, high performance solution to meet the reliability, availability, and scalability requirements for our server family.'' Sun developed the ASIC chipset architecture, partitioning and design while LSI Logic provided technology, physical design methodology, custom I/Os, manufacturing and test. LSI Logic design center teams from Massachusetts, Minnesota and California concentrated on different design blocks using its FlexStream® ``hierarchical'' design flow. LSI Logic designers were able to achieve system-level performance requirements on the I/O interfaces by using advanced clocking methodology, advanced 3-D parasitic extraction interconnect modeling and implementing tight skew control. To meet the high performance system design requirements, the chipset includes many custom I/Os, phase lock loops (PLLs) and high-performance memories. The chipset also features the use of LSI Logic's industry-leading organic high-performance flip chip package family. ``Our long, established relationship with Sun has resulted from our commitment to keeping our customers at the leading edge of the technology curve,'' said Dave Jones, vice president and general manager of LSI Logic's Storage and Computer ASIC Division. ``Our engineering teams worked together to ensure that the chipset enabled the high-performance, scalable and cost-effective solution that met Sun's time-to-market requirements.'' LSI Logic's superior ASIC methodology and Right-First-Time designs meet or exceed our customers' critical time-to-market requirements. LSI Logic can design scalable and expandable customized solutions through a library of cores, including Ethernet Gigabit and 10 Gigabit MAC and PHY cores, HyperPHY, 3GIO, PCI/PCI-X, DDR and the GigaBlaze® high-speed serial transceiver core. In addition, LSI Logic's world-class flxI/O flip chip ball grid array package family and standard package families provide a cost-effective, high performance ASIC and system-on-a-chip (SoC) solutions. For further information visit www.lsilogic.com