Hitachi Signs Letter of Intent to Join QDR Co-development Team

BOISE, ID -- Cypress Semiconductor Corp. (NYSE:CY), Integrated Device Technology, Inc. (Nasdaq:IDTI), Micron Technology, Inc. (NYSE:MU), NEC Corporation (Nasdaq:NIPNY), and Samsung Electronics Co, Ltd. (KSE:05930) today announced that Hitachi, Ltd. (NYSE:HIT) has signed a letter of intent to join the Quad Data Rate (QDR(TM)) co-development team to design and manufacture a complete family of Quad Data Rate and Double Data Rate (DDR) static RAM (SRAM) devices. QDR and DDR devices are multi-sourced, high-performance memory architectures designed to provide customers with the highest performance data-rate family of products needed for use in switches, routers and other communications applications. "We are pleased to announce we are joining the QDR co-development team," said Bob Fusco, Director of System Memory Product Business Unit, Hitachi Semiconductor (America) Inc. "The QDR group defined a complete family of networking SRAM products with superior timing and functionality. Our customers tell us QDR products are their choice for networking applications." "The addition of Hitachi to the QDR co-development team enhances our strength in the marketplace," said Hiroyuki Goto, Senior Manager, Memory Engineering and Marketing for NEC Electronics. "Hitachi is a well-known SRAM technology leader, and their participation enhances the capabilities of the team throughout the world and, specifically, gives our customers in Asia increased local support." Each member company provides system expertise and product direction. Customers receive the collective benefit of the members' wide-range of market experience and innovative technology. "With the addition of Hitachi, the QDR co-development team will comprise six leading SRAM suppliers, each contributing its own state-of-the-art technology," said Jerry Johnson, Micron's Strategic Product Marketing Director for Networking. "Having multiple, independent suppliers ensures that QDR and DDR customers will always have an assured supply of leading-edge SRAM products for their networking and communications applications." Rather than depending on foundries, each company uses its own state-of-the-art fabrication facilities. This provides assurance for customers using QDR products on key critical factors. For instance, each QDR member has the ability to directly control all resources required to respond to customers' needs. Also, customers are assured that future generations of QDR products will be based on the latest fabrication technology and product specifications. Lastly, customers can be assured that packaging footprints for QDR products are leading edge. "Hitachi's extensive high-speed SRAM experience and their 0.13 micron process capability adds to a strong foundation already established by the other five suppliers," said Mario Martinez, Strategic Marketing Director for Cypress's Memory Products Division. "With such a powerful team of suppliers on board, QDR and DDR customers are assured of a memory architecture that will handle their design requirements well into the future." Like other co-development team members, Hitachi will design their devices using their own technology and will manufacture them in their own fabrication facilities. Hitachi products will be delivered to market according to the company's internal schedules. "The Networking Community has voiced a strong need for high-performance SRAM products tailored specifically to meet their unique system requirements. QDR products offer the best solution to their needs," said Mike Pearson, Director of Networking Business Development, Samsung Semiconductor, Inc. "We welcome Hitachi joining the QDR co-development team. It is a strategic move that will benefit all our customers." For more information visit www.qdrsram.com or http://global.hitachi.com