INTERCONNECTS

The IEEE Hot Interconnects conference, a leading international forum on supercomputing, high-frequency trading and low-latency communication for financial-market applications, will start tomorrow. After 16 years in Silicon Valley, the three-day conference moves to New York, where it will unite Wall Street executives with technologists, academics and government officials. The conference will be held at the Credit Suisse headquarters, at 11 Madison Ave.

Experts will discuss state-of-the-art architectures and implementations for interconnection networks of all scales, ranging from on-chip interconnects to wide-area networks. Two days of technical sessions led by Keren Bergman, Columbia University and 2009 General Chair and a day of tutorials to keep you on top of the latest industry developments and academic laboratories.

“High-performance interconnects are increasingly relevant to technology-driven financial institutions where transmitting massive volumes of information at nearly the speed of light is crucial to successful trading executions. We’re talking about microseconds, which can make a real difference in terms of money,” says Keren Bergman, professor of electrical engineering and chair of the conference.

“To be competitive today, Financial Services IT is being asked more and more to increase trade execution speeds to near instantaneous, moving from milliseconds to microseconds with the ultimate goal to approach zero. As Credit Suisse leads the pack in these efforts, we are happy to host this event and to see it come home to Wall Street,” says Raj Channa, Credit Suisse IT Director of Arbitrage Trading.

As you know, these are interesting times for Wall Street. They will certainly prove to be interesting for this 17th Annual Hot Interconnects Conference.