PROCESSORS

ARMONK, NY -- IBM today announced that Intel has selected IBM server technology as one of the validation platforms to test the upcoming Intel(R) Xeon (TM) processor MP and next-generation Itanium (TM) processors. Intel is testing its 32- and 64-bit processors using IBM's "Summit" chipset technology in order to validate that the new processors can be deployed in enterprise-class servers, a milestone when bringing new microprocessors to market. Intel's validation effort will allow IBM's eServer(a) xSeries(b) systems powered by Summit to be one of the first Intel-based servers to market based on the Intel Xeon MP. Intel is also using IBM Summit technology to validate the next-generation of its Itanium processor, code-named "McKinley," which is expected to be available in 2002. IBM's Summit is the first chipset that is designed to work with upcoming processors from both the Intel Xeon processor and Itanium processor families. "With the first generation of Itanium viewed by many IT experts as a development platform for Intel's 64-bit architecture, customers will likely wait for the second generation Itanium chip called McKinley before deploying business critical applications," said Vernon Turner, vice president, systems and servers, IDC. "Meanwhile, the IBM Summit chipset will provide customers with a performance advantage to exploit the computing power of IA32 that will be magnified once McKinley arrives. IBM will be one of the first to market with a battle tested chipset when the second generation of 64 bit computing is available from Intel." Composed of a group of IBM chips joined to an Intel processor, the Summit Chipset improves performance and scalability -- the ability to link processors together to create larger systems -- while adding mainframe-like features to an Intel-based server, such as advanced I/O capabilities. Each Summit chipset joins as many as four Intel Xeon MP processors together -- enabling them to share resources such as I/O and memory -- resulting in up to a 20 percent increase in overall system performance. "The enterprise capabilities for the IBM Summit chipset, combined with scalable and reliable Intel Xeon processor, is a winning solution for customers seeking to run their business-critical applications on high performance, enterprise-class servers," said Mike Fister, Vice President and General Manager for Intel's Enterprise Platforms Group. "IBM is taking the three major components of industry standard server technology -- processors, memory and I/O -- and powering them with advanced features to help standard systems perform at new levels," said Deepak Advani, vice president, IBM eServer xSeries. "IBM is the only company that can bring its mainframe technology know-how and high end enterprise capabilities to the industry standard space at an affordable cost." The culmination of decades of IBM experience with mainframe and midrange system design, Summit capitalizes on IBM microprocessor technologies, including copper and silicon on insulator chip technology. Borrowing design attributes from IBM mainframe processor modules, the chipset's advanced features increase the speed of communication between processors that "talk" with each other while completing tasks. In addition, Summit will incorporate advanced PCI-X performance features designed to effectively double data transfer rates. With Summit's Remote I/O capabilities, additional systems such as storage devices will able to be connected at a distance from the server for greater flexibility. For more information visit www.ibm.com/eserver