SCIENCE

MIDLAND, MI -- Speeding the adoption of low-k dielectrics into advanced fab lines, The Dow Chemical Company and nine other semiconductor equipment and materials suppliers announced today the launch of an industry-wide alliance to develop compatible, production-ready processes for SiLK(a) semiconductor dielectric resins, the leading low-k dielectric materials for the 130nm technology node and beyond. Together as the SiLKnet Alliance, members will combine chipmaking expertise to streamline fab processes, develop new, compatible products and expand integration knowledge for SiLK dielectric resins. Founding alliance members include Arch Chemicals Inc., Ashland Specialty Chemical Company, Dainippon Screen Mfg. Co. Ltd., EKC Technology Inc., Ferro Corporation, Planar Solutions LLC, Supercritical Systems Inc., Tokyo Electron Limited and Verteq Inc. Discussions with additional suppliers are ongoing. "SiLK, already the leading choice for 130nm logic device production, is rapidly emerging as the leading low-k candidate material for the 100nm technology node," said Mark McClear, global business director for Dow Advanced Electronic Materials. "The formation of the SiLKnet Alliance - the first and broadest collaboration of its kind - marks an important milestone in the industry's adoption of low-k materials. By bringing together a diverse, non-exclusive group of suppliers, the alliance will build industry-wide integration expertise for SiLK semiconductor dielectric resins, making the move to low-k a lower-risk proposition for our customers." As the industry adopts advanced low-k materials, IC manufacturers have turned to equipment and materials suppliers to develop compatible chipmaking processes. Members of the SiLKnet Alliance will have access to a pool of blank and patterned/partially processed SiLK-coated wafers, which will be used to develop new and optimized equipment, materials and processes for SiLK films. SiLKnet members will make the technical information from these developments available to customers through links to the SiLKnet Web site (www.silknetalliance.com), being launched this month, and links to individual company Web sites. Coordination of all SiLKnet Alliance activities will be spearheaded by Greg Bauer, alliance development director, and Michael Simmonds, alliance application development manager, both of Dow. Bauer is responsible for driving the commercial aspects for the alliance, while Simmonds is chartered with the technical components of the program. SiLKnet is a non-exclusive alliance, open to all suppliers in the semiconductor equipment and materials community. For more information about SiLKnet Alliance, visit www.silk.dow.com