EXTOLL, a leader in high-speed, ultra-low-power SerDes and chiplet connectivity, has been selected as a key SerDes IP partner by BeammWave for its upcoming communication ASIC development. This collaboration utilizes GlobalFoundries' (GF) 22nm FD-SOI process technology, 22FDX, to create advanced solutions for mmWave 5G/6G digital beamforming.

The partnership underscores EXTOLL's expertise in ultra-low-power design, ensuring energy-efficient, high-performance chiplet-based solutions to meet the increasing demand for multi-lane connectivity. EXTOLL's SerDes IP core supports data transmission speeds of up to 32 Gbps per lane and is compatible with GF's 22FDX, 12LP, and 12LP+ platforms.

Advancing 5G/6G with energy-efficient solutions

Dirk Wieberneit, CEO of EXTOLL, highlighted the importance of this collaboration, stating, "This partnership showcases EXTOLL's strength in ultra-low-power design, particularly on GF's 22FDX process technology, enabling future communication innovations. We are honored to partner with BeammWave in shaping the future of digital beamforming technology."

GlobalFoundries' 22FDX technology is renowned for superior RF/mixed-signal performance, power efficiency, and system-on-chip (SoC) integration. It provides an ideal foundation for next-generation beamforming applications, where power efficiency and high-speed connectivity are crucial.

Industry leaders applaud the collaboration

Per-Olof Brandt, BeammWave's Chief Technology Officer, expressed enthusiasm for the partnership: "We are thrilled to collaborate with EXTOLL on their industry-leading Very Short Reach SerDes technology in 22nm. Their ongoing innovation in this area allows us to deliver best-in-class power and performance for our ambitious mmWave 5G/6G products."

Ziv Hammer, Senior Vice President of Design Platforms and Services at GlobalFoundries, emphasized the growing market demand for 22FDX technology and the impact of EXTOLL's innovations: "As demand for beamforming applications increases, we are excited to see our IP partner EXTOLL continue to innovate on this technology node. Their ultra-low-power interconnect solutions enable next-generation chiplet technologies, reinforcing our commitment to supporting global connectivity."

Shaping the future of high-speed connectivity

As the demand for high-speed, energy-efficient connectivity grows, the collaboration between EXTOLL, BeammWave, and GlobalFoundries sets a new benchmark in 5G/6G digital beamforming technology. Combining GF's speed technology, EXTOLL's advanced SerDes IP, and BeammWave's expertise in mmWave innovations, this partnership aims to drive the future of ultra-fast, energy-efficient communications.