Eco-System Members Join to Present the Latest Product, Application and Standard Developments in an Informative, Easy-To-Join Forum -- Engineering managers, system architects, and embedded product developers are invited to attend the RapidIO Trade Association's Boston Global Design Summit to be held August 17th, from 9:00 a.m. to 5:30 p.m. at the Woburn Plaza Hotel. The Summit will provide valuable information on RapidIO technology and products and include working demonstrations in the technology lab. Sessions, application papers and design tips will be presented by RapidIO Trade Association members including Fabric Embedded Tools Corporation (FET), Freescale Semiconductor, FuturePlus Systems, Integrated Device Technology (IDT), Jennic, Mercury Computer Systems, Texas Instruments, Tundra Semiconductor Corporation, and Xilinx. "This extraordinary Design Summit is structured to aid the embedded design community in learning how to get better system performance, reliability and support for convergence by using the high-speed, flexible RapidIO interconnect and fabric," said Tom Cox, executive director of the RapidIO Trade Association. The free, full-day event includes a track of technical sessions highlighting RapidIO technology, interconnect comparisons, software considerations, RapidIO and distributed processing, wireless application design, and RapidIO products. In addition, a technology lab will feature multi-vendor RapidIO interoperability demonstrations using state-of-the-art RapidIO products. A complimentary light breakfast, lunch and snacks will be provided. Space is limited and attendees are encouraged to register prior to August 8th. For registration details visit its Web site. For general questions and more information, contact Sue Leininger, 512.305.0070. All attendees will be entered in prize drawings for copies of RapidIO: The Next Generation Communication Fabric for Embedded Application, the definitive reference book (one for every 20 registered attendees) and the grand prize of an iPod nano. Attendees must be present to win. Mr. Cox added, "Attendees will be able to talk first-hand with technical experts to understand how RapidIO technology provides the best solution for system-level interconnect issues and discover the breadth of RapidIO products, from IP to processors to DSPs to switches to software to full system solutions that are available to help build next-generation systems." In addition to the Boston event, Global RapidIO Design Summits have been scheduled throughout Asia-Pacific this Fall. Summits will be held in Tokyo, Japan, on September 12th, Seoul, South Korea, on September 14th, Shenzhen, China, on October 24th, and in Bangalore, India, on November 14th. Details can be found on its Web site. Dates of these events are subject to change, and interested attendees are asked to check the web site often. Hosted by the RapidIO Trade Association, the 2006 Global Design Summits are sponsored by Altera, AMCC, EMC, ENEA, Ericsson, Freescale Semiconductor, Lucent Technologies, Mercury Computer Systems, Micro Memory, MontaVista, PMC- Sierra, Rydal, Texas Instruments, Tundra Semiconductor Corporation, Wind River, and Xilinx. RapidIO technology is an established, scalable, packet-switched, high- performance fabric specifically developed to address the needs of equipment designers in the wireless infrastructure, edge networking, storage, scientific, military and industrial markets. Under active development since June 1997, the RapidIO standard represents continued commitment of the RapidIO Trade Association to addressing the needs of the ever-changing networking and communications marketplace. The RapidIO Trade Association and its global members drive the RapidIO interconnect architecture. This ISO-certified, open-standard seamlessly enables the chip-to-chip, board-to-board, control, backplane and data plane interconnections needed in high-performance networking, communications and embedded systems. The growth of the RapidIO ecosystem in 2005 seeded deployment of RapidIO technology in next generation wireless infrastructure, edge networking and military systems. Over 2006, the deployment of RapidIO will be furthered through RapidIO Trade Association initiatives including interoperability, interworking, the next Generation PHY Release, and system-level application demonstrations. Detailed information on the RapidIO specification, products, design tools, member companies, and membership is available at its Web site.