Modeling Airflow With CoolSim Improves Data Center Thermal Efficiency, Reduces Costs and Helps Eliminate Heat-Related Equipment Failures: Applied Math Modeling Inc. announced that it has entered into an exclusive agreement with ANSYS, Inc. for the distribution, support and ongoing development of CoolSim, a product focused on modeling the thermal environment of data centers. CoolSim is a hosted product that utilizes advanced ANSYS CFD solvers to compute the temperature, pressure and airflow within a data center. With the recent increased focus on data center cooling and efficiency, CoolSim has shown to be an effective tool for predicting the effect of changes in the data center. Paul Bemis, CEO of Applied Math Modeling, said: "According to the EPA, companies can achieve up to 30 percent greater energy efficiency simply by improving the airflow within the data center. With data centers consuming an estimated $4.7 billion in 2006 according to the EPA's most recent report to Congress, the opportunity for cost savings and improved efficiency is significant. With CoolSim, data center facility managers and planners can easily optimize rack and computer room air conditioning (CRAC) unit placement. They can also quickly identify potential thermal troublespots, which can lead to equipment failure and downtime. The market opportunity is significant, and we are pleased that ANSYS has chosen us as a strategic partner to help IT organizations solve these important challenges. We look forward to continuing the development and support of CoolSim." CoolSim uses an easy to use graphical interface enabling users to quickly create a model of their data center. The model is then automatically submitted to a hosted server for processing where results in the form of HTML output reports and 3D visual images are produced and sent to the user. This mechanism allows users to perform multiple "what-if" studies of their data centers to determine the optimal placement of equipment, or the effect of adding equipment to an existing data center. "Up to this point, the facilities and IT planning functions have not had an ability to model the effect of additional servers or cooling equipment on the data center," said Bemis. "CoolSim is an excellent planning tool, providing the ability to model the performance of new data center designs or changes to existing centers, therefore greatly reducing the risk of equipment failure due to heat." "We are very pleased to enter into this strategic relationship with Applied Math Modeling for the distribution, support and ongoing development of CoolSim," said Chris Reid, vice president of marketing at ANSYS. "This will enable the ANSYS CoolSim solution to reach a much broader audience by providing additional focus and domain expertise in the key target application of data center thermal modeling."