Mobile World Congress has announced that several of the industry’s major chipset vendors have selected SanDisk’s iNAND embedded storage device for use in their new reference designs—the boards on which next-generation mobile phones and tablets are developed. As the trusted storage solution provider for hundreds of mobile phone and consumer electronic designs, SanDisk is uniquely positioned to help OEMs optimize the performance of their products.

SanDisk works closely with industry leaders such as Texas Instruments Incorporated (TI), Windows Phone, Freescale Semiconductor, Intel Corporation, Marvell, Microsoft Corporation and NVIDIA to optimize how its iNAND (e.MMC interface) and integrated solid state drive (iSSD) flash storage products interact with the processors, operating systems and usage models of the specific devices in which they are used. This fine-tuning process makes it easier for OEMs to design mobile devices with the best possible performance and user experience. To view demonstrations of how these vendors implement SanDisk’s embedded devices into their designs, Mobile World Congress attendees can visit the partner pavilion located in Hall P8, Stand 8B91.

“TI’s OMAP 4 platform delivers breakthrough performances and best-in-class power management technology. With the Blaze mobile development platform, customers can develop innovative usage models on various operating systems,” said Fred Cohen, director, OMAP wireless ecosystem, TI. “With the availability of complementary technologies like SanDisk’s embedded memory, customers can incorporate a scalable storage solution to deliver better user experiences, faster boot times, and seamless multi-tasking across applications, all with a faster time-to-market.”

The world’s top mobile chipset vendors leverage SanDisk’s flash memory expertise to ensure tight integration between the iNAND storage device and the processor. This results in faster phone boot times, application launches, Internet browsing and overall system responsiveness.

SanDisk also meets SATA interface requirements in high-end productivity tablets, and works closely to optimize chipset integration for its iSSD product line. Utilizing industry-leading mobile usage analysis capabilities, SanDisk designs its storage products with a firm understanding of the needs of end users and then shares this insight when engaging with mobile chipset vendors.

“As mobile devices continue to offer a growing array of advanced features, greater cohesion between storage and processor vendors is required,” said Flint Pulskamp, research director, wireless and wired communications semiconductors, IDC. “Developers who tightly integrate all aspects of hardware and software design are more likely to meet a device manufacturer’s reliability, performance, size and cost criteria.”

“OEMs trust SanDisk because we are closely aligned with the design and engineering teams of all the major chipset designers,” said Yoram Zylberberg, director, strategic business development, OEM, SanDisk. “As a result, no matter which processor a manufacturer chooses, they know that our iNAND embedded storage device is optimally integrated with it. This allows them to develop mobile devices that offer the best possible user experience within their cost envelope.”

“SanDisk’s iNAND and iSSD storage devices are tightly integrated with our chipsets, enabling optimal performance, product longevity and low power consumption,” said Rajeev Kumar, i.MX product line manager for consumer products, Freescale. “As computing, mobile and consumer electronics continue to converge, SanDisk’s e.MMC and SATA solutions help to deliver a scalable platform that meets the current and future needs of many OEM customers."

SanDisk offers a wide range of products and services for its OEM customers. These include high-volume manufacturing through joint ownership of the largest NAND flash fabs, a broad intellectual patent portfolio of more than 2,700 patents, leading NAND flash designs and process technologies as well as a global brand and reputation for high quality.